Recommended systems for electrical and electronic components
HE225/ HH225/SILICA=100/80/300 phr |
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Application:
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Viscosity |
At 25 ºC , mPa.s |
180000 |
Viscosity |
At 60 ºC , mPa.s |
9000 |
Tg (DSC) |
ºC |
110-125 |
Impact toughness |
Kj/m2 |
8-15 |
Tensile |
MPa / % |
70-85 |
Flexural |
MPa / % |
120-140 |
Cure shrinkage |
% |
0.5-0.7 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HE2857/ HH2587/SILICA=100/100/320 phr |
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Application:
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Viscosity |
At 25 ºC , mPa.s |
175000 |
Viscosity |
At 60 ºC , mPa.s |
7900 |
Tg (DSC) |
ºC |
70-85 |
Impact toughness |
Kj/m2 |
10-15 |
Tensile |
MPa / % |
65-85 |
Flexural |
MPa / % |
110-140 |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1-0.15 |
HE3863/HH3863/SILICA=100/100/350 phr |
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Application:
|
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Viscosity |
At 25 ºC , mPa.s |
160000 |
Viscosity |
At 60 ºC , mPa.s |
58500 |
Tg (DSC) |
ºC |
80-90 |
Impact toughness |
Kj/m2 |
10-16 |
Tensile |
MPa / % |
65-85 |
Flexural |
MPa / % |
120-150 |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HW |
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Application:
|
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Viscosity |
At 40ºC , mPa.s |
45000 |
Viscosity |
At 60 ºC , mPa.s |
12500 |
Tg (DSC) |
ºC |
110-125 |
Impact toughness |
Kj/m2 |
10-16 |
Tensile |
MPa / % |
80-95 |
Flexural |
MPa / % |
120-150 |
Cure shrinkage |
% |
0.5-0.9 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HW |
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Application:
|
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Viscosity |
At 40ºC , mPa.s |
55000-98000 |
Viscosity |
At 60 ºC , mPa.s |
12000-23000 |
Tg (DSC) |
ºC |
90-105 |
Impact toughness |
Kj/m2 |
7-13 |
Tensile |
MPa / % |
60-85 |
Flexural |
MPa / % |
120-140 |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HW2982/HH2982=100/30 phr |
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Application:
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Viscosity |
At 40ºC , mPa.s |
1600-1850 |
Viscosity |
At 60 ºC , mPa.s |
100 |
Tg (DSC) |
ºC |
65-75 |
Impact toughness |
Kj/m2 |
10-15 |
Tensile |
MPa / % |
65-85 |
Flexural |
MPa / % |
115-135 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HE6681/HH6681/SILICA=100/40/200 phr |
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Application:
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Viscosity |
At 40ºC , mPa.s |
700-1500 |
Hardness |
Shore D |
80 |
Volume resist. |
Ω.cm |
4.0×10^12 |
Di-electricity co. |
Kv/mm |
15 min |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HE6683/HH6683/SILICA=100/40/200 phr |
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Application:
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Viscosity |
At 40ºC , mPa.s |
1200-2100 |
Hardness |
Shore D |
80 |
Flexural |
MPa |
70~95 |
Tensile |
MPa |
40~60 |
Volume resist. |
Ω.cm |
4.0×10^12 |
Di-electricity co. |
Kv/mm |
15 min |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HW7915/HH7915=100/40/200 phr |
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Application:
|
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Viscosity |
At 25ºC , mPa.s |
17000 |
Viscosity |
At 60ºC , mPa.s |
1200 |
Tg (DSC) |
ºC |
105-120 |
Impact toughness |
Kj/m2 |
4-8 |
Tensile |
MPa / % |
48-60 |
Flexural |
MPa / % |
80-100 |
Cure shrinkage |
% |
0.6-0.8 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HE5276/HH5276/SILICA=100/100/270 phr |
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Application:
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Viscosity |
At 25ºC , mPa.s |
165000-195000 |
Viscosity |
At 60ºC , mPa.s |
8000-12500 |
Tg (DSC) |
ºC |
115-125 |
Impact toughness |
Kj/m2 |
8-15 |
Tensile |
MPa / % |
65-80 |
Flexural |
MPa / % |
110-140 |
Cure shrinkage |
% |
0.6-0.8 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |
HW3863/HH3863/SILICA=100/100/300-380 phr |
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Application:
|
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Viscosity |
At 25ºC , mPa.s |
160000 |
Viscosity |
At 60ºC , mPa.s |
130000 |
Tg (DSC) |
ºC |
80-90 |
Impact toughness |
Kj/m2 |
10-16 |
Tensile |
MPa / % |
65-85 |
Flexural |
MPa / % |
120-150 |
Cure shrinkage |
% |
0.8-1.0 |
Water uptake |
10 days @25 ºC,% |
0.1–0.15 |